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Glossary of Terms
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Crystal Production
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Crystal Blank Crystal Blank Crystal Oscillator
Cutting and
Measuring
cutting angle
A synthetically grown quartz
bar is lumbered into thin quartz
wafers according to the specified
cutting angle, which has direct
relationship to the frequency vs.
temperature characteristic.
Base Plating The electrode, used for applying
an electric field to the crystal
blank, is formed by vacuum metal
deposition using silver on
the top of the crystal blank.
Dimensioning
the blank
Depending on the oscillator
package, the blank is rounded or
cut into rectangular shape.
Mounting
crystal
blank into
substrate
The crystal blank is mounted on
supporting springs with silver
paste making electrical contact to
the electrodes on each side of the
blank.
Lapping Lapping machine grind the wafer
surfaces using abrasives while
maintaining flatness.
The thinner the blank, the higher
the frequency.
Final Plating The frequency of each oscillator
is measured while silver is
evaporated onto one side of an
exposed electrode until the target
frequency is reached.
Beveling To cause vibrations to occur
at the center, the crystal piece is
shaped into the form of lens.
Sealing by
Resistance
Welding
The inside of a oscillator is
evacuated and filled with the inert
Nitrogen gas to prevent electrodes
from being oxidized or influenced
by ambient temperature.
Etching and
Cleaning
The quartz blanks are etched in
a solution to improve the surfaces
finish and reduce the spread in
frequency of the production batch.
Aging and
Electrical test
After aging at an elevated
temperature for a period of time,
the electrical specifications are
tested.
#809, C-Dong, Bundang Technopark #145 Yatab-Dong, Bundang-Ku
TEL) 82-31-707-3600 | FAX) 82-31-707-3603
Copyright (c) 2003 Seoan Electronics Co., Ltd. All rights reserved.

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